Advances in Atomic Layer Deposition

نویسندگان

چکیده

Abstract Atomic layer deposition (ALD) is a thin-film fabrication technique that has great potential in nanofabrication. Based on its self-limiting surface reactions, ALD excellent conformality, sub-nanometer thickness control, and good process compatibility. These merits promote the industrial research applications of various fields. This article provides an introduction to highlights semiconductors, pan-semiconductors, environment energy, other The key nodes integrated circuits are initially demonstrated, area-selective discussed as bottom-up method for self-aligned nanomanufacturing. Emerging illustrated passivation layers, functional buffer which have shown development trend miniaturization diversification. enabling atomic close-to-atomic scale manufacturing (ACSM) materials, structures, devices, systems versatile applications. use theory calculation, multiscale simulation, more novel methods would steer into further evolution, makes it possible cater demand ACSM.

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ژورنال

عنوان ژورنال: Nanomanufacturing and Metrology

سال: 2022

ISSN: ['2520-811X', '2520-8128']

DOI: https://doi.org/10.1007/s41871-022-00136-8